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Articles (28)
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1

A Miniature Mechanical-Piezoelectric-Configured Three-Axis Vibrational Energy Harvester

Hung, Chiao-Fang, Chung, Tien-Kan, Yeh, Po-Chen, Chen, Chin-Chung, Wang, Chieh-Min, Lin, Shin-Hung

Journal:

IEEE Sensors Journal

Année:

2015

Langue:

english

Fichier:

PDF, 5.40 MB

english, 2015

2

A Three-Axial Frequency-Tunable Piezoelectric Energy Harvester Using a Magnetic-Force Configuration

Chung, Tien-Kan, Wang, Chieh-Min, Yeh, Po-Chen, Liu, Tzu-Wei, Tseng, Chia-Yuan, Chen, Chin-Chung

Journal:

IEEE Sensors Journal

Année:

2014

Langue:

english

Fichier:

PDF, 917 KB

english, 2014

3

A Novel Three-Axial Magnetic-Piezoelectric MEMS AC Magnetic Field Sensor

Yeh, Po-Chen, Duan, Hao, Chung, Tien-Kan

Journal:

Année:

2019

Fichier:

PDF, 7.81 MB

2019

4

Electromagnetic/Magnetic-Coupled Targeting System for Screw-Hole Locating in Intramedullary Interlocking-Nail Surgery

Wong, Tze-Hong, Chung, Tien-Kan, Liu, Tzu-Wei, Chu, Hou-Jen, Hsu, Wensyang, Yeh, Po-Chen, Chen, Chin-Chung, Lee, Meng-Shiue, Yang, Yuh-Shyong

Journal:

IEEE Sensors Journal

Année:

2014

Langue:

english

Fichier:

PDF, 3.58 MB

english, 2014

5

A Miniature Magnetic-Piezoelectric Thermal Energy Harvester

Chen, Chin-Chung, Chung, Tien-Kan, Tseng, Chia-Yuan, Hung, Chiao-Fang, Yeh, Po-Chen, Cheng, Chih-Cheng

Journal:

IEEE Transactions on Magnetics

Année:

2015

Langue:

english

Fichier:

PDF, 16.75 MB

english, 2015

6

SPIE Proceedings [SPIE SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring - San Diego, California, USA (Sunday 9 March 2014)] Smart Sensor Phenomena, Technology, Networks, and Systems Integration 2014 - An ultrahigh sensitive self-powered current sensor utilizing a piezoelectric connected-in-series approach

Ecke, Wolfgang, Peters, Kara J., Meyendorf, Norbert G., Matikas, Theodoros E., Yeh, Po-Chen, Chung, Tien-Kan, Lai, Cheng-Huang

Année:

2014

Langue:

english

Fichier:

PDF, 578 KB

english, 2014

7

Synergistic Effect in the Solvent Extraction of Thorium

Yeh, Si-Jung, Chu, Po-Chen

Journal:

Journal of the Chinese Chemical Society

Année:

1963

Langue:

english

Fichier:

PDF, 605 KB

english, 1963

8

A magnetic-piezoelectric smart material-structure sensing three axis DC and AC magnetic-fields

Hung, Chiao-Fang, Chen, Chin-Chung, Yeh, Po-Chen, Chen, Po-Wen, Chung, Tien-Kan

Journal:

Applied Physics

Année:

2017

Langue:

english

Fichier:

PDF, 1.26 MB

english, 2017

9

A Miniature Magnetic-Force-Based Three-Axis AC Magnetic Sensor with Piezoelectric/Vibrational Energy-Harvesting Functions

Hung, Chiao-Fang, Yeh, Po-Chen, Chung, Tien-Kan

Journal:

Année:

2017

Langue:

english

Fichier:

PDF, 3.68 MB

english, 2017

10

A Novel Three-Axial Magnetic-Piezoelectric MEMS AC Magnetic Field Sensor

Yeh, Po-Chen, Duan, Hao, Chung, Tien-Kan

Journal:

Année:

2019

Langue:

english

Fichier:

PDF, 7.81 MB

english, 2019

11

A new tri-functional azetidine compound for self-curing aqueous-based PU system

Shih-Chieh Wang, Po-Chen Chen, Jing-Zhong Hwang, Chi-Yuan Huang, Jen-Taut Yeh, Kan-Nan Chen

Journal:

Journal of Applied Polymer Science

Année:

2012

Langue:

english

Fichier:

PDF, 501 KB

english, 2012

12

[IEEE 2009 First Asian Conference on Intelligent Information and Database Systems, ACIIDS - Dong hoi, Quang binh, Vietnam (2009.04.1-2009.04.3)] 2009 First Asian Conference on Intelligent Information and Database Systems - Stability Analysis of Fuzzy Control for Nonlinear Systems

Chen, Po-Chen, Yeh, Ken, Chen, Cheng-Wu, Lin, Shu-Hao

Année:

2009

Langue:

english

Fichier:

PDF, 129 KB

english, 2009

13

[IEEE 2009 First Asian Conference on Intelligent Information and Database Systems, ACIIDS - Dong hoi, Quang binh, Vietnam (2009.04.1-2009.04.3)] 2009 First Asian Conference on Intelligent Information and Database Systems - Application to GA-Based Fuzzy Control for Nonlinear Systems with Uncertainty

Chen, Po-Chen, Yeh, Ken, Chen, Cheng-Wu, Chen, Chen-Yuan

Année:

2009

Langue:

english

Fichier:

PDF, 121 KB

english, 2009

14

Lateral Rectus Myositis Presented as Binocular Diplopia

Wu, Ming-Che, Po-Chen Lin, Aven, Lee, Ping-Hsun, Li, Ming-Tsung, Yeh, Yu-Hang

Journal:

The Journal of Emergency Medicine

Année:

2015

Langue:

english

Fichier:

PDF, 204 KB

english, 2015

15

[ASME ASME 2012 Conference on Smart Materials, Adaptive Structures and Intelligent Systems - Stone Mountain, Georgia, USA (Wednesday 19 September 2012)] Volume 2: Mechanics and Behavior of Active Materials; Integrated System Design and Implementation; Bio-Inspired Materials and Systems; Energy Harvesting - A Micro Kinetic Energy Harvester Demonstrating Energy Harvesting From 3-D Mechanical Motion and Power Increasing Through Magnetic-Based Frequency Rectification

Chung, Tien-Kan, Wang, Chieh-Min, Tseng, Chia-Yuan, Liu, Tzu-Wei, Yeh, Po-Chen

Année:

2012

Langue:

english

Fichier:

PDF, 1.24 MB

english, 2012

16

A magnetic–piezoelectric smart material-structure utilizing magnetic force interaction to optimize the sensitivity of current sensing

Yeh, Po-Chen, Chung, Tien-Kan, Lai, Chen-Hung, Wang, Chieh-Min

Journal:

Applied Physics A: Materials Science & Processing

Année:

2016

Langue:

english

Fichier:

PDF, 1.35 MB

english, 2016

17

[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Lidded FCCSP warpage evaluation: Process modeling and characterization of the effect of viscoelasticity and cured shrinkage for molded underfill

Yeh, Shu-Shen, Lin, Po-Yao, Jeng, Shin-Puu, Lin, Wen-Yi, Yew, Ming-Chih, Lee, Kuang-Chun, Wang, Jin-Hua, Lai, Po-Chen, Leu, Shyue-Ter

Année:

2016

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2016

18

[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fan-out wafer molding process optimization using cure-dependent viscoelastic modeling and characterizations

Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Hsu, Chia-Kuei, Yang, Che-Chia, Jeng, Shin-Puu

Année:

2017

Langue:

english

Fichier:

PDF, 1.45 MB

english, 2017

19

[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Characterization methodologies for copper/polymer interfacial strength

Hsu, Chia-Kuei, Lin, Po-Yao, Lin, Wen-Yi, Yew, Ming-Chih, Yeh, Shu-Shen, Lee, Kuang-Chun, Wang, Jin-Hua, Lai, Po-Chen, Yang, Che-Chia, Jeng, Shin-Puu

Année:

2017

Langue:

english

Fichier:

PDF, 1.14 MB

english, 2017

20

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages

Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Leu, Shyue-Ter, Jeng, Shin-Puu

Année:

2017

Langue:

english

Fichier:

PDF, 506 KB

english, 2017

21

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages

Hsu, Chia-Kuei, Lin, Po-Yao, Lin, Wen-Yi, Yew, Ming-Chih, Yeh, Shu-Shen, Lee, Kuang-Chun, Wang, Jin-Hua, Lai, Po-Chen, Yang, Che-Chia, Jeng, Shin-Puu

Année:

2018

Fichier:

PDF, 362 KB

2018

22

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - An Integrated Warpage Prediction Model Based on Chemical Shrinkage and Viscoelasticity for Molded Underfill

Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Hsu, Chia-Kuei, Yang, Che-Chia, Jeng, Shin-Puu

Année:

2018

Langue:

english

Fichier:

PDF, 684 KB

english, 2018

23

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages

Hsu, Chia-Kuei, Lin, Po-Yao, Lin, Wen-Yi, Yew, Ming-Chih, Yeh, Shu-Shen, Lee, Kuang-Chun, Wang, Jin-Hua, Lai, Po-Chen, Yang, Che-Chia, Jeng, Shin-Puu

Année:

2018

Langue:

english

Fichier:

PDF, 362 KB

english, 2018

24

An Attachable Electromagnetic Energy Harvester Driven Wireless Sensing System Demonstrating Milling-Processes and Cutter-Wear/Breakage-Condition Monitoring

Chung, Tien-Kan, Yeh, Po-Chen, Lee, Hao, Lin, Cheng-Mao, Tseng, Chia-Yung, Lo, Wen-Tuan, Wang, Chieh-Min, Wang, Wen-Chin, Tu, Chi-Jen, Tasi, Pei-Yuan, Chang, Jui-Wen

Journal:

Année:

2016

Langue:

english

Fichier:

PDF, 3.45 MB

english, 2016

25

Optimization analysis of a magnetic-piezoelectric current sensor

Yeh, Po-Chen, Chung, Tien-Kan

Journal:

Journal of Physics Conference Series

Année:

2018

Langue:

english

Fichier:

PDF, 1.00 MB

english, 2018

26

[IEEE 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2018.10.24-2018.10.26)] 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process

Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Hsu, Chia-Kuei, Yang, Che-Chia, Liao, Li-Ling, Lin, Yu-Sheng, Jeng, Shin-Puu

Année:

2018

Langue:

english

Fichier:

PDF, 8 KB

english, 2018

27

[IEEE 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Berlin, Germany (2019.6.23-2019.6.27)] 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - 3D Printed Bio-Sensing Chip for the Determination of Bacteria Antibiotic-Resistant Profile

Yeh, Po-Chen, Chen, Juhong, Karakurt, Ilbey, Lin, Liwei

Année:

2019

Langue:

english

Fichier:

PDF, 2.30 MB

english, 2019

28

[IEEE 2019 IEEE Asia-Pacific Microwave Conference (APMC) - Singapore, Singapore (2019.12.10-2019.12.13)] 2019 IEEE Asia-Pacific Microwave Conference (APMC) - A 94 GHz 10.8 mW Low-Noise Amplifier With Inductive Gain Boosting in 40 nm Digital CMOS Technology

Yeh, Po-Chen, Kuo, Chien-Nan

Année:

2019

Fichier:

PDF, 1022 KB

2019